lab vacuum drying oven Features
The HS050ZKG vacuum oven is designed for high-precision processes, achieving an ultra-high vacuum of 1Pa within 60 minutes, meeting stringent vacuum environment requirements.
The equipment employs unique partition heating technology, ensuring temperature uniformity of ±3℃, providing a stable and reliable heat treatment environment for sensitive materials.
The double-layer temperature-controlled partition design, with each layer capable of supporting up to 20kg, is particularly suitable for oxygen-free baking and aging testing of chips and semiconductor components.
Equipped with a 7-inch high-definition touchscreen, it displays parameters such as temperature, time, and vacuum level in real time, offering intuitive and easy operation.
With a 50L working chamber volume and compact structure, it is suitable for small-batch vacuum processing of high-value products in laboratories and R&D centers.
The vacuum system employs a highly efficient pumping scheme to quickly establish and maintain a 1Pa vacuum environment, ensuring process repeatability.
Customized vacuum levels and internal dimensions are supported.
High-tech Enterprise certification with 25 years testing equipment manufacturer.
Owned factory premises covering 22,691 square meters.
Full-process in-house production.
One-stop testing solution provider.
ISO 9001:2015, ISO 14001:2015 and ISO 45001:2018 certificated factory.
Bulk ordering would be with a lower price.
Small MOQ is available of course.
Our Services
3D Design Review: For large or customized drying ovens, we will provide design drawings for your review within 7 days of contract signing. Production can begin once the review is approved.
12-month free warranty and 24-hour online service.
Product images and videos are available before shipment.
Product performance is tested before leaving the factory, and we can provide you with factory inspection reports.
Lifetime technical support.
Our partner & Honor
FAQ
Q: What vacuum level can this equipment achieve? How long does it take?
A: It can achieve a vacuum level of 1 Pa, and can do so rapidly within 60 minutes, far exceeding the efficiency of ordinary vacuum equipment.
Q: How is the heating uniformity? What products is it suitable for processing?
A: It uses partition heating technology, achieving a temperature uniformity of ±3℃, making it particularly suitable for temperature-sensitive products such as chips and semiconductor components.
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