Vacuum Curing Oven

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Vacuum Curing Oven
Details
Rapidly removes moisture from materials at high-temperature drying temperatures. Particularly suitable for the pharmaceutical, food, and biological product industries, effectively protecting the activity of heat-sensitive components and preventing high-temperature decomposition or inactivation.
Category
Vacuum Drying Oven
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Description
 
 
vacuum curing oven Features

 

01/

Rapidly removes moisture from materials at high-temperature drying temperatures. Particularly suitable for the pharmaceutical, food, and biological product industries, effectively protecting the activity of heat-sensitive components and preventing high-temperature decomposition or inactivation.

02/

Vacuum levels and vacuum chamber internal dimensions can be customized to your requirements.

03/

Lower energy consumption compared to traditional drying methods, effectively reducing operating costs for businesses.

04/

Multiple standard models with internal volumes of 24L, 91L, 216L, and 512L are available.

05/

Employs special heating technology to ensure uniform heating of materials and avoid uneven drying.

06/

Equipped with a high-quality vacuum pump; vacuum levels can be displayed on an instrument panel.

 

 

Vacuum curing oven Specifications

 

 

 

Model

HS002ZK

HS010ZK

HS020ZK

Performance

Temp. Range

R.T+20℃~200℃

Temp.Fluctuations

±1℃

Temperature resolution

0.1℃

Specification

Working Room Dimensions(mm)

300×300×270

450x450x450

600×600×600

Outer Dimensions Around(mm)

510×400×480

660×700×1480

810×800×1780

Content Volume

24L

91L

216L

Power(KW)

0.9KW

2.5KW

3.5KW

Power Supply

220V 50HZ

Shelf

2 stainless steel shelves

Disposition

Structural

Integral, the control panel is placed on the front of the equipment.

Exterior Material

Cold-rolled steel plate with electrostatic double-sided spraying.

Internal Material

High quality stainless steel plate

Insulation

Fiberglass

Temp. Sensor

Pt100 Platinum resistance

Heater

Nichrome electric heater

Regulation mode

Natural convection circulation balances the temperature

Temp. Display

Measuring and setting temperatures can be digitally displayed with LED

Vacuum System

Vacuum

133Pa

Vacuum system

Direct-coupled rotary vane vacuum pump. Vacuum auxiliary parts, domestic high-quality devices, such as vacuum sensors, solenoid valves, etc.

Pressure control and display

Analog pressure gauge

Vacuum pressure digital display, adjustable

Remarks

The inner and outer dimensions are marked as:D×W×H;

Recommended conditions for device use:Ambient temperature 5℃~+30℃,Ambient humidity:≤85%RH;

The above data are measured under no-load conditions.

 

vacuum curing oven Advantages

High-tech Enterprise certification with 25 years testing equipment manufacturer.

Owned factory premises covering 22,691 square meters.

Full-process in-house production.

One-stop testing solution provider.

ISO 9001:2015, ISO 14001:2015 and ISO 45001:2018 certificated factory.

Bulk ordering would be with a lower price.

Small MOQ is available of course.

 

product-1400-693

 

 

Our Services

 

 

3D Design Review: For large or customized drying ovens, we will provide design drawings for your review within 7 days of contract signing. Production can begin once the review is approved.

12-month free warranty and 24-hour online service.

Product images and videos are available before shipment.

Product performance is tested before leaving the factory, and we can provide you with factory inspection reports.

Lifetime technical support.

 

Our partner & Honor

 

 

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product-1400-693

 

FAQ

 

 

Q: What vacuum level can this equipment achieve? How long does it take?

A: It can achieve a vacuum level of 1 Pa, and can do so rapidly within 60 minutes, far exceeding the efficiency of ordinary vacuum equipment.

 

Q: How is the heating uniformity? What products is it suitable for processing?

A: It uses partition heating technology, achieving a temperature uniformity of ±3℃, making it particularly suitable for temperature-sensitive products such as chips and semiconductor components.

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