Features
Employing a double-layer stacked structure, the two independent chambers are arranged vertically, requiring only the space of a single unit while doubling processing capacity.
Each chamber measures 600×600×600mm with a total volume of 216L, meeting the processing needs of medium-batch samples.
Utilizing a three-duct circulation system with full-panel air supply and return on both sides, it ensures temperature uniformity ≤2℃, meeting the high-precision requirements of chip testing.
Equipped with multiple safety devices including over-temperature protection, fan overheat protection, and a robust power system, ensuring long-term stable operation.
A sliding adjustable air inlet door is located on the front, with automatic program control for precise airflow adjustment.
Standard and customized ovens can be manufactured.
The equipment's operating temperature range is RT+20～＋200℃.
Our Services
3D Design Review: For large or customized benchtop temperature test chamber, we will provide design drawings for your review within 7 days of contract signing. Production can begin once the review is approved.
12-month free warranty and 24-hour online service.
Product images and videos are available before shipment.
Product performance is tested before leaving the factory, and we can provide you with factory inspection reports.
Lifetime technical support.
Our partner & Honor
FAQ
Q: Can two different processes be performed simultaneously in the high-temperature test chamber?
A: Yes. The upper and lower chambers have completely independent temperature control, allowing for simultaneous setting of different temperature processes without interference.
Q: Does the double-layer design affect operational convenience?
A: Each layer has an independent door and operating interface, making operation very convenient.
Q: Is a nitrogen system required?
A: The equipment comes standard with a nitrogen supply system, including a fast/slow switching valve and a flow meter, which can be directly connected to a nitrogen source.
Q: What is the difference between a three-duct system and a single-duct system? How should I choose?
A: The choice between a three-duct and a single-duct system mainly depends on your test's requirements for temperature uniformity. A three-duct high temperature test oven can achieve a temperature uniformity of ≤2℃, while a single-duct oven achieves ±2.5%℃.
♦ The following is a schematic diagram of the air duct structure for your reference:
The "three-duct" structure features a large outlet area and a large return area, with airflow organized as a "piston flow," or laminar flow. This results in good temperature field uniformity.
Schematic diagram of the internal air duct structure of a traditional drying oven ("single air duct" structure).
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